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Spec FirePro M3900 AMD
Overview
Product name AMD FirePro M3900
Architecture TeraScale 2
Generation / family FirePro M Series
Launch date 2010-10-19
Market segment Mobile
Board type / entry type Laptop GPU
GPU
Process node TSMC 40 nm
Die size 67 mm²
Transistor count 0.37 billion
GPU chip Seymour
Stream Processors 160
ROPs 4
TMUs 8
Clocks
Base / Core clock 750 MHz
Boost clock 750 MHz
Memory clock 900 MHz
Memory
Memory size 1 GB
Memory type GDDR3
Memory bus width 64-bit
Memory bandwidth 14.4 GB/s
Bus / Interface
Bus interface PCIe 2.0 x16
AGP / PCI / PCIe distinction PCIe
Power
TDP / TBP / board power 20 W
Features
DirectX support DirectX 11.0
OpenGL support OpenGL 4.4
Shader Model 5.0
Performance / Benchmarks
FP32 throughput 0.24 TFLOPS

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