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Spec FirePro M8900 AMD
Overview
Product name AMD FirePro M8900
Architecture TeraScale 2
Generation / family FirePro M Series
Launch date 2011-04-12
Market segment Mobile
Board type / entry type Laptop GPU
GPU
Process node TSMC 40 nm
Die size 212 mm²
Transistor count 1.7 billion
GPU chip Blackcomb
Stream Processors 960
ROPs 32
TMUs 48
Clocks
Base / Core clock 680 MHz
Boost clock 680 MHz
Memory clock 900 MHz
Memory
Memory size 2 GB
Memory type GDDR5
Memory bus width 256-bit
Memory bandwidth 115.2 GB/s
Bus / Interface
Bus interface MXM-B (3.0)
AGP / PCI / PCIe distinction MXM-B (3.0)
Power
TDP / TBP / board power 75 W
Slot width MXM Module
Features
DirectX support DirectX 11.0
OpenGL support OpenGL 4.4
Shader Model 5.0
Performance / Benchmarks
FP32 throughput 1.31 TFLOPS

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